- Our Services
SiPH Design and Fabrication
Driving the Future of Silicon Photonics
At CompoundTek, we turn your photonics vision into reality — from design to wafer fabrication.
Our end-to-end Silicon Photonics (SiPh) expertise helps you move from concept to market faster, with precision, scalability, and performance built in.
Whether you’re developing new products or scaling production, CompoundTek is your trusted partner in next-generation photonics innovation.
Comprehensive SiPh Services
Accelerate innovation with our full suite of design-to-fabrication solutions:
•Design Support & Consultation – Expert advice to enhance performance and manufacturability.
•Wafer Fabrication – 8” CMOS-compatible processes delivering top-quality results on time.
•Testing & Validation – Electrical, RF, and optical testing for proven reliability.
•Advanced Packaging – Copper pillar bump technology for efficient interconnects.
•Wafer Dicing & Failure Analysis – Precision services ensuring yield and quality.
•Custom Process Development – Tailored fabrication for unique SiPh applications.
Comprehensive SiPh Services
Accelerate innovation with our full suite of design-to-fabrication solutions:
•Design Support & Consultation – Expert advice to enhance performance and manufacturability.
•Wafer Fabrication – 8” CMOS-compatible processes delivering top-quality results on time.
•Testing & Validation – Electrical, RF, and optical testing for proven reliability.
•Advanced Packaging – Copper pillar bump technology for efficient interconnects.
•Wafer Dicing & Failure Analysis – Precision services ensuring yield and quality.
•Custom Process Development – Tailored fabrication for unique SiPh applications.
Our Capabilities
•Proprietary PDK integrated with Lumerical, Cadence, Mentor Graphics, and Luceda.
•Industry-first 3-sigma variation CML model for high-precision, manufacturable designs.
•Regular MPW runs for rapid, cost-effective prototyping.
•Scalable mass production for market-ready devices.
•Ultra-Low Loss Waveguides and Non-Hermetic Processes for superior performance.
New Materials – TFLN Support for High-Speed Silicon Photonics
CompoundTek’s latest integration of Thin-Film Lithium Niobate (TFLN) enables a new era of high-speed, low-loss electro-optic performance in Silicon Photonics.
This hybrid SiPh–TFLN platform combines the scalability of silicon with the exceptional modulation speed and efficiency of lithium niobate, empowering next-generation optical interconnects and telecom applications.
Key Advantages:
•High-speed modulation for advanced data communication systems•Ultra-low optical loss for improved signal integrity
•Seamless integration with existing CMOS-compatible SiPh platforms
•Scalable manufacturing with high yield and process uniformity
•CompoundTek’s TFLN platform extends the performance boundaries of Silicon Photonics — merging speed, efficiency, and manufacturability for the next wave of photonic innovation.
Multi-Project Wafer (MPW) Services
Prototype faster. Spend smarter.
Our MPW services let you share wafer space for cost-efficient SiPh circuit fabrication — without compromising on quality.
Why Choose CompoundTek MPW:
•Lower fabrication costs through shared wafer space
•Fast turnaround and flexible scheduling
•Access to advanced SiPh technology
•Custom support for your project needs
•15 unique reticle fields (3mm × 15.7mm) for optimized layouts
•Ideal for startups, researchers, and enterprises pushing the limits of SiPh innovation.
Precision. Flexibility. Performance.
Our SiPh wafer fabrication platform delivers:
•90nm geometry, 3-Metal Copper Interconnect CMOS process
•Low-loss and ultra-low-loss Si and SiN waveguides
•Mach–Zehnder modulators, Ge PIN photodetectors, and on-chip heaters
•Edge couplers (suspended and non-suspended)
•Copper pillar bump packaging technology
Partner with CompoundTek
Bring your Silicon Photonics project to life — with precision, speed, and scalability at every stage.
NEXT-GENERATION SILICON PHOTONICS
CompoundTek is redefining high-speed photonics with our advanced SiPh–TFLN (Thin-Film Lithium Niobate) platform — delivering unmatched modulation speed, low loss, and scalable integration.
From design to wafer fabrication, we help you bring innovation to market faster.
Platform Features:
- 90nm geometry 3-Metal Copper Interconnect CMOS-compatible process
- Low-loss and ultra-low-loss silicon waveguides
- Low-loss silicon nitride waveguides
- Comprehensive suite of passive elements
- Mach-Zehnder modulators
- Vertical and lateral Germanium PIN photodetectors
- Efficient on-chip heater element
- Suspended and non-suspended edge couplers
- Copper pillar bump for advanced interconnects
Partner with CompoundTek to bring your silicon photonics project to life with precision, efficiency, and scalability.